Teledyne Optech, Teledyne DALSA and Teledyne Scientific & Imaging, all part of the Teledyne Imaging group, are pleased to announce their combined presence at the AUVSI Xponential 2019 show in Chicago, IL, April 29 - May 2. The three companies will showcase their new and advanced sensor and imaging solutions.

New Compact Lidar Family from Teledyne Optech

Preview a new, lightweight, compact lidar platform for UAV deployment ─ the CL-90 features exceptional canopy penetration, offering the lowest-noise, highest-quality survey grade data to deliver extraordinary performance in data accuracy and point precision. The CL-90 empowers full lidar performance across the entire operating altitude range of the UAV and offers an exclusive variable field-of-view capability eliminating the need for multiple passes over a target.

Advanced Thermal and Visible Cameras from Teledyne DALSA

Featuring the Genie™ Nano family of low cost area cameras, their lightweight, power-efficient and compact size make them ideal for Unmanned Aerial Vehicles (UAV) applications. The Falcon™ 4, 86 megapixel ultra-high resolution and high-speed CMOS camera offers unique, capabilities for large area, high resolution, high speed imaging. The Calibir™ series, Long Wave Infrared (LWIR) cameras deliver compact, low profile thermal solutions, ideal for UAV applications such as agriculture, construction, defense, and surveying. Calibir is customizable with smart embedded algorithms and capability for real-time VIS-LWIR image fusion.

Artificial Intelligence for Automatic UAV Sensor Data Processing from Teledyne Scientific & Imaging

Preview a new Artificial Intelligence (AI) software stack capable of real-time performance onboard UAVs. The AI stack enables automatic sensor processing for applications such as sensor fusion, asset recognition and tracking, and adaptive dynamic range ideal for deployment in daytime and variable light operations.

Where: AUVSI Xponential 2019 Booth #2520 McCormick Place Chicago, Illinois

When: April 30 – May 2, 2019

For more information, click here.

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